Nintendo


 * https://www.nintendo.com

https://www.nintendo.com

Models

 * Nintendo 3DS XL New (SPR-002) (2015) • Teardown
 * • Nintendo 1446 17 CPU LGR A - CPU (ARM core)
 * • Samsung KLM4G1YEMD-B031 4GB - NAND Flash
 * • Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
 * • Atheros AR6014G-AL1C - Wi-Fi SoC
 * • Texas Instruments 93045A4 49AF3NW G2 - PMIC
 * • Renesas Electronics UC KTR 442KM13 TK14 - MCU
 * • Texas Instruments AIC3010D 48C01JW - Codec IC
 * • NXP S750 1603 TSD438C - Infrared IC
 * • Texas Instruments PH416A - I/O Expander


 * Nintendo 3DS XL (SPR-001) (2015) • Teardown
 * • Nintendo 1446 17 CPU LGR A - CPU (ARM Core)
 * • Samsung KLM4G1YEMD-B031 4GB - NAND Flash
 * • Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
 * • Atheros AR6014G-AL1C - Wi-Fi SoC
 * • NXP S750 1603 TSD438C - Infrared IC


 * Nintendo 3DS New (CTR-002) •
 * Nintendo 3DS (CTR-001) • Teardown • Hardware
 * • CPU: ARM11 MPCore @268MHz, ARM9 @134MHz
 * • GPU: DMP PICA200 @268MHz
 * • Flash: Toshiba THGBM2G3P1FBAI8 1GB
 * • RAM: Fujitsu MB82M8080-07L 128MB (2x 64MB)
 * • Wi-Fi: Atheros AR6014G-AL1C - Wi-Fi SoC
 * • FCC ID: EW4DWMW028 (Mitsumi DWM-W028)
 * • Audio: Texas Instruments AIC3010B (Codec IC)
 * • Gyroscope: Invensense ITG-3270 MEMS
 * • Accelerometer: STMicro LIS331DH


 * Nintendo 2DS (FTR-001) •
 * Nintendo N3DS (KTR-001)
 * Nintendo N3DS XL (RED-001)
 * Nintendo N2DS XL (JAN-001)


 * Nintendo Switch (HAC-001) (2017) • Teardown
 * System-on-chip used: Nvidia Tegra X1 @1.02GHz
 * CPU: Quad-core Cortex-A57 + Quad-core Cortex-A53
 * Memory: 4GB LPDDR4; Storage: 32GB eMMC
 * Removable storage: microSD/HC/XC (up to 2TB)
 * Display: 6.2" 1280×720p LCD (237ppi)
 * Up to 1080p via HDMI while docked


 * Nintendo Switch Lite (HDH-001/002) (2019)


 * Nintendo Switch OLED (HEG-001) (2021) • Teardown


 * Nintendo Classic Mini (CLV-101) (2016) • HoneyLab
 * • CPU: Allwinner R16 (Quad Core ARM Cortex-A7)
 * • GPU: Mali-400MP2; Flash: Macronix (NAND); RAM: Nanya


 * Nintendo Classic Super (EU/AU) - (2017)

Models Specifications

 * https://3dbrew.org/wiki/Hardware


 * [11] Official Documentation
 * [5], [10] According to iFixit.com (Teardown):
 * Datasheet for memory is for a chip in the same series, it has less
 * memory than the one inside the 3DS (128MB vs 512MB).


 * There is a trove of data on the FCC website at EW4DWMW028.
 * [12] This IC is somewhat similar to NXP.
 * The Raw ID data for Wi-Fi SPI Flash is from command 0x9F, RDID.