HiSilicon

HiSilicon Technologies Co., Ltd.

 * http://www.hisilicon.com

Processors

 * HiSilicon Processors


 * HiSilicon Kirin 980 (7nm); Octa-core (2x Cortex-A76 @2.60GHz, 2x Cortex-A76 @1.92GHz, 4x Cortex-A55 @1.8GHz)
 * HiSilicon Kirin 970 (12nm), Octa-core (4x 2.4GHz Cortex-A73 & 4x 1.8GHz Cortex-A53)
 * HiSilicon Kirin 710 (12nm), Octa-core (4x 2.2GHz Cortex-A73 & 4x 1.7GHz Cortex-A53)

Premium
<!-- Model	CPU	GPU	DSP	ISP	RAM	Modem	Catalog name	Litography	Release date

Intermediate

Model	CPU	GPU	DSP	ISP	RAM	Modem	Catalog number	Litography	Release date

HiSilicon Kirin 985 1x ARM Cortex-A76 @ 2.58 GHz 3x ARM Cortex-A76 @ 2.40 GHz 4x ARM Cortex-A55 @ 1.84 GHz 8x ARM Mali-G77		Kirin ISP 5.0	LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s)	5G		"7 nm" TSMC N7 DUV	2020/04

HiSilicon Kirin 820 1x ARM Cortex-A76 @ 2.36 GHz 3x ARM Cortex-A76 @ 2.22 GHz 4x ARM Cortex-A55 @ 1.84 GHz 6x ARM Mali-G57		Kirin ISP 5.0	LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s)	5G		"7 nm" TSMC N7 DUV	2020/03

HiSilicon Kirin 820E 3x ARM Cortex-A76 @ 2.22 GHz 3x ARM Cortex-A55 @ 1.84 GHz 6x ARM Mali-G57		Kirin ISP 5.0	LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s)	5G		"7 nm" TSMC N7 DUV	2021/01

HiSilicon Kirin 810 2x ARM Cortex-A76 @ 2.27 GHz 6x ARM Cortex-A55 @ 1.9 GHz 6x ARM Mali-G52 @ 820 MHz			LPDDR4X Quad-channel 16-bit @ 2133 MHz (34.1 GB/s)	4G		"7 nm" TSMC N7 DUV	2019/06

HiSilicon Kirin 710A 4x ARM Cortex-A73 @ 2.0 GHz 4x ARM Cortex-A53 @ 1.7 GHz 4x ARM Mali-G51 @ 1000 MHz			LPDDR4 32-bit	4G (600 / 150 mbps)		"14 nm" SMIC 14 FinFET	2020/05

HiSilicon Kirin 710 4x ARM Cortex-A73 @ 2.2 GHz 4x ARM Cortex-A53 @ 1.7 GHz 4x ARM Mali-G51 @ 1000 MHz			LPDDR4 32-bit	4G (600 / 150 mbps)		"12 nm" TSMC 12 FinFET	2018/07

Model	CPU	GPU	DSP	ISP	RAM	Modem	Catalog name	Litography	Release date

Basic

Model	CPU	GPU	DSP	ISP	RAM	Modem	Catalog number	Litography	Release date

HiSilicon Kirin 659 4x ARM Cortex-A53 @ 2.36 GHz 4x ARM Cortex-A53 @ 1.7 GHz 2x ARM Mali-T830		(16 megapixels)	LPDDR3 dual-channel 32-bit @ 933 MHz	4G (300 mbps)		"16 nm" TSMC 16FF+	2017/07

HiSilicon Kirin 658 4x ARM Cortex-A53 @ 2.35 GHz 4x ARM Cortex-A53 @ 1.7 GHz 2x ARM Mali-T830		(16 megapixels)	LPDDR3 dual-channel 32-bit @ 933 MHz	4G (300 mbps)		"16 nm" TSMC 16FF+	2017/03

HiSilicon Kirin 655 4x ARM Cortex-A53 @ 2.12 GHz 4x ARM Cortex-A53 @ 1.7 GHz 2x ARM Mali-T830		(16 megapixels)	LPDDR3 dual-channel 32-bit @ 933 MHz	4G (300 mbps)		"16 nm" TSMC 16FF+	2016/10

HiSilicon Kirin 650 4x ARM Cortex-A53 @ 2.0 GHz 4x ARM Cortex-A53 @ 1.7 GHz 2x ARM Mali-T830		(16 megapixels)	LPDDR3 dual-channel 32-bit @ 933 MHz	4G (300 mbps)		"16 nm" TSMC 16FF+	2016/04

HiSilicon Kirin 620 4x ARM Cortex-A53 @ 1.2 GHz 4x ARM Mali-450		(13 megapixels)	LPDDR3 single-channel 32-bit @ 600 MHz (6.4 GB/s)	4G (150 mbps)		"28 nm" TSMC 28HPM	2015/04

Model	CPU	GPU	DSP	ISP	RAM	Modem	Catalog name	Litography	Release date

See also

Apple MediaTek Qualcomm Samsung System LSI

HiSilicon processors

Premium Kirin 910 910T 920 925 928 930 935 950 955 960 970 980 990 9000E 9000 Intermediate Kirin 710 810 820E 820 985 Basic Kirin 620 650 655 658 659

Latest processors

Apple M2 (2022/Jun) MediaTek Dimensity 1050 (2022/May) MediaTek Dimensity 930 (2022/May) MediaTek Helio G99 (2022/May) Qualcomm Snapdragon 8+ Gen 1 (2022/May) Qualcomm Snapdragon 7 Gen 1 (2022/May) Apple M1 Ultra (2022/Mar) Samsung Exynos 1280 (2022/Mar) MediaTek Dimensity 8100 (2022/Mar) MediaTek Dimensity 8000 (2022/Mar) MediaTek Dimensity 1300 (2022/Mar) Samsung Exynos 2200 (2022/Jan) Qualcomm Snapdragon 8 Gen 1 (2021/Dec) MediaTek Dimensity 9000 (2021/Nov) Qualcomm Snapdragon 778G+ (2021/Oct) Qualcomm Snapdragon 695 (2021/Oct) Qualcomm Snapdragon 680 (2021/Oct) Qualcomm Snapdragon 480+ (2021/Oct) Google Tensor (2021/Oct) Apple M1 Max (2021/Oct)

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Models

 * Huawei AX3 (WS7100) (AX3000) • AC|WiFi • PPage
 * CPU: HiSilicon Hi5651L @1.2GHz (Dual-core ARM)
 * Flash/RAM: 128MB/128MB (in SoC), 12V/1A,
 * WLAN: HiSilicon Hi1152 (2x 2T2R)


 * Huawei AX3 Pro (WS7200) (AX3000) • AC|WiFi • PPage
 * CPU: HiSilicon Hi5651T @1.4GHz (Quad-core ARM)
 * Flash/RAM: 128MB/256MB, 12V/2A,
 * WLAN: HiSilicon Hi1152 (2x 2T2R)


 * Huawei A2 (WS5800) (AC2200) • AC|WiFi
 * CPU: HiSilicon Hi5651T @1.4GHz (Quad-core ARM)
 * Flash/RAM: 128MB/256MB, 12V/2A,
 * WLAN: 3x HiSilicon Hi1151 (2x 2T2R)


 * Huawei Honor Pro2 (Honor Cube)
 * CPU: HiSilicon Hi5651T @1.4GHz (Quad-core ARM)


 * Huawei Honor X2 (Honor Cube) • PPage
 * Model: HiRouter CD20 (AC1200) • Spec.
 * CPU: HiSilicon Hi5651H @800MHz (Quad-core ARM)


 * Huawei Honor X1 Pro (Honor Cube)
 * Model: Honor Router X1 Enhanced (AC1200) • PPage
 * CPU: HiSilicon Hi5651H @800MHz (Quad-core ARM)


 * Huawei Honor Pro (WS851) • Review
 * CPU: HiSilicon Hi5650T @1GHz (Dual-core ARM Cortex-A9)
 * Flash: 128MB, RAM: 256MB • Spec.


 * Huawei WS831 (Honor Cube) • Spec.
 * CPU: HiSilicon Hi5650H @1GHz (Dual-core ARM Cortex-A9)


 * Huawei WS860s (Honor Cube)
 * CPU: HiSilicon Hi5650H @1 GHz (Dual-core ARM Cortex-A9)


 * Huawei WS5200 - AC1200 • Teardown on AC|WiFi (CN)
 * CPU: Realtek RTL8197FS/RTL8812BRH/RTL8367RB
 * Flash: Macronix MX35LF1GE4AB-Z4IH (128MB NAND)
 * FCC ID: QISWS5200 (2018-05-11) • AC1200


 * Huawei WS5200 v2 - AC1200 • AC|WiFi • AC|WiFi
 * CPU: HiSilicon Hi5651H @800MHz (Dual-core ARM)
 * CPU: HiSilicon Hi5651T @1GHz (Quad-core ARM)
 * Flash/RAM: 16MB/128MB (Winbond), 12V/1A
 * WLAN: 2x HiSilicon Hi1151 (2x 2T2R)
 * FCC ID: QISWS5200V2 (2019-11-12)


 * Huawei HG8010 - EchoLife GPON ONT • PPage
 * CPU: HiSilicon SD5116 - Products


 * Huawei HG8240 - EchoLife GPON ONT • PPage
 * EchoLife HG8240 EPON Terminal (PX20+) • ich8 blog
 * CPU: HiSilicon SD5113 (RBI) @530MHz (Hass ARM11)


 * Huawei EchoLife EG8245H - GPON ONT (HiSilicon SD5115 ?)
 * Huawei HG8245A - GPON ONT (HiSilicon SD5115)
 * Huawei HG8245H - GPON ONT (HiSilicon SD5115)
 * Huawei MA5675M - PON Gateway • ich8 blog
 * CPU: HiSilicon SD5203 (MA5671)


 * WRTnode Hi - see WRTnode (MT7620N)
 * SoC: HiSilicon Hi3516A (AV100) @600MHz
 * ARM Cortex-A7 with NEON and FPU