Nintendo


 * https://www.nintendo.com

https://www.nintendo.com

Models

 * Nintendo 3DS XL New (SPR-002) (2015) • Teardown
 * • Nintendo 1446 17 CPU LGR A - CPU (ARM core)
 * • Samsung KLM4G1YEMD-B031 4GB - NAND Flash
 * • Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
 * • Atheros AR6014G-AL1C - Wi-Fi SoC
 * • Texas Instruments 93045A4 49AF3NW G2 - PMIC
 * • Renesas Electronics UC KTR 442KM13 TK14 - MCU
 * • Texas Instruments AIC3010D 48C01JW - Codec IC
 * • NXP S750 1603 TSD438C - Infrared IC
 * • Texas Instruments PH416A - I/O Expander


 * Nintendo 3DS XL (SPR-001) (2015) • Teardown
 * • Nintendo 1446 17 CPU LGR A - CPU (ARM Core)
 * • Samsung KLM4G1YEMD-B031 4GB - NAND Flash
 * • Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
 * • Atheros AR6014G-AL1C - Wi-Fi SoC
 * • NXP S750 1603 TSD438C - Infrared IC


 * Nintendo 3DS New (CTR-002) •
 * Nintendo 3DS (CTR-001) • Teardown • Hardware
 * • CPU: ARM11 MPCore @268MHz, ARM9 @134MHz
 * • GPU: DMP PICA200 @268MHz
 * • Flash: Toshiba THGBM2G3P1FBAI8 1GB
 * • RAM: Fujitsu MB82M8080-07L 128MB (2x 64MB)
 * • Wi-Fi: Atheros AR6014G-AL1C - Wi-Fi SoC
 * • FCC ID: EW4DWMW028 (Mitsumi DWM-W028)
 * • Audio: Texas Instruments AIC3010B (Codec IC)
 * • Gyroscope: Invensense ITG-3270 MEMS
 * • Accelerometer: STMicro LIS331DH


 * Nintendo 2DS (FTR-001) •
 * Nintendo N3DS (KTR-001)
 * Nintendo N3DS XL (RED-001)
 * Nintendo N2DS XL (JAN-001)


 * Nintendo Switch (HAC-001) (2017) • Teardown
 * System-on-chip used: Nvidia Tegra X1 @1.02GHz
 * CPU: Quad-core Cortex-A57 + Quad-core Cortex-A53
 * Memory: 4GB LPDDR4; Storage: 32GB eMMC
 * Removable storage: microSD/HC/XC (up to 2TB)
 * Display: 6.2" 1280×720p LCD (237ppi)
 * Up to 1080p via HDMI while docked
 * Sound: Undocked: Linear PCM 2.0ch stereo speakers)
 * Docked: Linear PCM 5.1ch
 * Operating system: Nintendo Switch system software


 * Motherboard:
 * • CPU: NVIDIA ODNX02-A2 (presumably the Tegra X1-based SoC)
 * • Toshiba THGBMHG8C2LBAIL - 32GB eMMC NAND Flash IC (module)
 * • Samsung K4F6E304HB-MGCH - 2GB LPDDR4 DRAM (x2 total of 4GB)
 * • Broadcom/Cypress BCM4356 - 802.11ac 2×2 + Bluetooth 4.1 SoC
 * • Pericom Semiconductor PI3USB30532 - USB 3.0/DP1.2 matrix switch
 * • Maxim Integrated MAX77621AEWI+T - Three phase buck regulator (x2)
 * • Maxim Integrated MAX77620AEWJ+T - PMIC
 * • M92T36 630380 - Power management IC
 * • Realtek ALC5639 - Audio codec
 * • B1633 GCBRG HAC STD T1001216 - Accel ?
 * • Delta Electronics fan - 5V/0.33A


 * Module:
 * • Broadcom BCM20734 - Bluetooth 4.1/2.4GHz Transceiver
 * • STMicroelectronics NFCBEA 812006 33 - Likely NFC reader IC
 * • Macronix International MX25U4033E - 4Mb CMOS Flash


 * Nintendo Switch Lite (2019)
 * Nintendo Classic Mini (CLV-101) (2016) • HoneyLab
 * • CPU: Allwinner R16 (Quad Core ARM Cortex-A7)
 * • GPU: Mali-400MP2; Flash: Macronix (NAND); RAM: Nanya


 * Nintendo Classic Super (EU/AU) - (2017)

Models Specifications

 * https://3dbrew.org/wiki/Hardware


 * [11] Official Documentation
 * [5], [10] According to iFixit.com (Teardown):
 * Datasheet for memory is for a chip in the same series, it has less
 * memory than the one inside the 3DS (128MB vs 512MB).


 * There is a trove of data on the FCC website at EW4DWMW028.
 * [12] This IC is somewhat similar to NXP.
 * The Raw ID data for Wi-Fi SPI Flash is from command 0x9F, RDID.