BEC Technologies MX-230 M1
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| LTE (LTE) | |||||
|---|---|---|---|---|---|
| 4G/LTE Industrial M2M Router | |||||
| WikiDevi.wi-cat.ru | BEC Technologies MX-230 M1 | ||||
| 3rd Party Firmware | |||||
| dd-wrt | Status Unknown | ||||
| OpenWrt | Status Unknown | ||||
| Tomato any flavor | Incompatible | ||||
| Platform | |||||
| Brand • Model • Rev | BEC Technologies MX-230M1 | ||||
| FCC ID | QI3BIL-MX230M1, XMR201707BG96, XMR | ||||
| IC ID | 10224A-201709BG96 | ||||
| Type | LTE router, 4G LTE router | ||||
| CPU1 | MediaTek MT7525 | ||||
| CPU1 Type | MIPS 34Kc | ||||
| CPU1 Speed | not specified | ||||
| CPU2 | Qualcomm MDM9206 | ||||
| CPU2 Type | ARM Cortex-A7 | ||||
| Flash1 Chip | Macronix MX25L25635FMI-10G | ||||
| Flash1 Size | 32 MiB 33,554,432 B <br />262,144 Kib <br />32,768 KiB <br />256 Mib <br />0.0313 GiB <br /> | ||||
| Flash2 Chip | Winbond W71NW10GE3FW | ||||
| Flash2 Size | 128 MiB134,217,728 B <br />1,048,576 Kib <br />131,072 KiB <br />1,024 Mib <br />0.125 GiB <br /> | ||||
| RAM1 Size | 64 MiB 67,108,864 B <br />524,288 Kib <br />65,536 KiB <br />512 Mib <br />0.0625 GiB <br /> | ||||
| RAM1 Chip | Winbond W9751G6KB25I | ||||
| RAM2 Size | 64 MiB67,108,864 B <br />524,288 Kib <br />65,536 KiB <br />512 Mib <br />0.0625 GiB <br /> | ||||
| RAM2 Chip | Winbond W71NW10GE3FW | ||||
| ETH chip1 | MediaTek MT7525 | ||||
| Ethernet Port Count |
1-WAN 1-1GbE-LAN | ||||
| Wired Standard | IEEE 802.3i/3u/3ab | ||||
| Expansion IF types | Mini PCIe | ||||
| Mini PCIe slots | 1 | ||||
| PoE | non-standard (otherwise unspecified) | ||||
| Power | 9 VDC, 1.34 A | ||||
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Flags: | |||||
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| Other | |||||
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Default IP address: 192.168.1.254 | |||||
| Retail | |||||
| FCC approval date | 09 August 2018 | ||||
| Country of manuf | Taiwan | ||||
| Radio 1 | |||||
| Radio1 module | Quectel BG96 | ||||
| Radio1 module IF | Mini PCIe | ||||
| Chip1 | Qualcomm MDM9206 | ||||
| Wireless interface OUI | none specified | ||||
| Antenna Connector Type | none specified | ||||
| Wireless Standard | LTE | ||||
| |||||
For a list of all currently documented MediaTek chipsets with specifications, see MediaTek.
For a list of all currently documented Qualcomm chipsets with specifications, see Qualcomm.
Overview
- Quectel BG96 LTE Cat. M1/NB1 & EGPRS Module
- is included with the product (CPU2, FLA2, RAM2)
- Winbond W71NW10GE3FW - Combo Memory Chip
- Flash: 1Gb (NAND) + RAM: 512Mb (LPDDR2)
See also: BEC Technologies MX-210NPV
Links of Interest
News
Categories:
- BEC Technologies
- Embedded system/LTE router
- Embedded system/4G LTE router
- Embedded System MediaTek
- Embedded System MT7525
- MediaTek
- Embedded System MIPS 34Kc
- Embedded System
- Embedded System Qualcomm
- Embedded System MDM9206
- Qualcomm
- Embedded System ARM
- Embedded System Cortex-A7
- Embedded System LTE
- Single-Radio Wireless Embedded System
- Wireless Embedded System
- English Documentation