BEC Technologies MX-230 M1
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LTE (LTE) | |||||
---|---|---|---|---|---|
4G/LTE Industrial M2M Router | |||||
WikiDevi.wi-cat.ru | BEC Technologies MX-230 M1 | ||||
3rd Party Firmware | |||||
dd-wrt | Status Unknown | ||||
OpenWrt | Status Unknown | ||||
Tomato any flavor | Incompatible | ||||
Platform | |||||
Brand • Model • Rev | BEC Technologies MX-230M1 | ||||
FCC ID | QI3BIL-MX230M1, XMR201707BG96, XMR | ||||
IC ID | 10224A-201709BG96 | ||||
Type | LTE router, 4G LTE router | ||||
CPU1 ![]() | MediaTek MT7525 | ||||
CPU1 Type | MIPS 34Kc | ||||
CPU1 Speed | not specified | ||||
CPU2 ![]() | Qualcomm MDM9206 | ||||
CPU2 Type | ARM Cortex-A7 | ||||
Flash1 Chip | Macronix MX25L25635FMI-10G | ||||
Flash1 Size | 32 MiB33,554,432 B <br />262,144 Kib <br />32,768 KiB <br />256 Mib <br />0.0313 GiB <br /> | ||||
Flash2 Chip | Winbond W71NW10GE3FW | ||||
Flash2 Size | 128 MiB134,217,728 B <br />1,048,576 Kib <br />131,072 KiB <br />1,024 Mib <br />0.125 GiB <br /> | ||||
RAM1 Size | 64 MiB67,108,864 B <br />524,288 Kib <br />65,536 KiB <br />512 Mib <br />0.0625 GiB <br /> | ||||
RAM1 Chip | Winbond W9751G6KB25I | ||||
RAM2 Size | 64 MiB67,108,864 B <br />524,288 Kib <br />65,536 KiB <br />512 Mib <br />0.0625 GiB <br /> | ||||
RAM2 Chip | Winbond W71NW10GE3FW | ||||
ETH chip1 | MediaTek MT7525 | ||||
Ethernet Port Count |
1-WAN 1-1GbE-LAN | ||||
Wired Standard | IEEE 802.3i/3u/3ab | ||||
Expansion IF types | Mini PCIe | ||||
Mini PCIe slots | 1 | ||||
PoE | non-standard (otherwise unspecified) | ||||
Power | 9 VDC, 1.34 A | ||||
Flags: | |||||
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Other | |||||
Default IP address: 192.168.1.254 | |||||
Retail | |||||
FCC approval date | 09 August 2018 | ||||
Country of manuf | Taiwan | ||||
Radio 1 | |||||
Radio1 module | Quectel BG96 | ||||
Radio1 module IF | Mini PCIe | ||||
Chip1 | Qualcomm MDM9206 | ||||
Wireless interface OUI | none specified | ||||
Antenna Connector Type | none specified | ||||
Wireless Standard | LTE | ||||
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For a list of all currently documented MediaTek chipsets with specifications, see MediaTek.
For a list of all currently documented Qualcomm chipsets with specifications, see Qualcomm.
Overview
- Quectel BG96 LTE Cat. M1/NB1 & EGPRS Module
- is included with the product (CPU2, FLA2, RAM2)
- Winbond W71NW10GE3FW - Combo Memory Chip
- Flash: 1Gb (NAND) + RAM: 512Mb (LPDDR2)
See also: BEC Technologies MX-210NPV
Links of Interest
News
Categories:
- BEC Technologies
- Embedded system/LTE router
- Embedded system/4G LTE router
- Embedded System MediaTek
- Embedded System MT7525
- MediaTek
- Embedded System MIPS 34Kc
- Embedded System
- Embedded System Qualcomm
- Embedded System MDM9206
- Qualcomm
- Embedded System ARM
- Embedded System Cortex-A7
- Embedded System LTE
- Single-Radio Wireless Embedded System
- Wireless Embedded System
- English Documentation