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D-Link DWL-900AP+ rev B
b (B11) | |||||||||||||||||
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Wireless Access Point | |||||||||||||||||
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Support | Support page | ||||||||||||||||
Wikipedia | D-Link | ||||||||||||||||
WikiDevi.wi-cat.ru | D-Link DWL-900AP+ rev A, B | ||||||||||||||||
3rd Party Firmware | |||||||||||||||||
dd-wrt | Incompatible | ||||||||||||||||
OpenWrt | Incompatible | ||||||||||||||||
Tomato any flavor | Incompatible | ||||||||||||||||
Platform | |||||||||||||||||
Brand • Model • Rev | D-Link DWL-900AP+ B | ||||||||||||||||
FCC ID | KA2DWL900AP-PLUS | ||||||||||||||||
Type | access point | ||||||||||||||||
CPU1 ![]() | Samsung S3C4510B | ||||||||||||||||
CPU1 Type | ARM7TDMI-S | ||||||||||||||||
CPU1 Speed | 200 MHz 32-bit | ||||||||||||||||
Flash1 Chip | Macronix MX29LV800BTC-90 | ||||||||||||||||
Flash1 Size | 1 MiB1,048,576 B <br />8,192 Kib <br />1,024 KiB <br />8 Mib <br />9.765625e-4 GiB <br /> | ||||||||||||||||
RAM1 Size | 8 MiB8,388,608 B <br />65,536 Kib <br />8,192 KiB <br />64 Mib <br />0.00781 GiB <br /> | ||||||||||||||||
RAM1 Chip | Winbond W986432DH-5 | ||||||||||||||||
ETH chip1 | Samsung S3C4510B | ||||||||||||||||
ETH chip2 | VIA VT6103 | ||||||||||||||||
Ethernet Port Count | 1-100MbE-LAN | ||||||||||||||||
Wired Standard | IEEE 802.3i/3u | ||||||||||||||||
Expansion IF types | PCMCIA (16-bit) | ||||||||||||||||
PCMCIA slots | 1 | ||||||||||||||||
Power | 5 VDC, 2 A | ||||||||||||||||
Connector type | barrel | ||||||||||||||||
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Retail | |||||||||||||||||
Availability | common | ||||||||||||||||
FCC approval date | 16 August 2002 | ||||||||||||||||
Radio 1 | |||||||||||||||||
Radio1 module | unknown | ||||||||||||||||
Radio1 module IF | PCMCIA (16-bit) | ||||||||||||||||
Chip1 | Texas Instruments ACX100 | ||||||||||||||||
Chip2 | RFMD Model? | ||||||||||||||||
Wireless interface OUI | 00:40:05 | ||||||||||||||||
Antenna Connector Type | RP-SMA | ||||||||||||||||
Wireless Standard | IEEE 802.11b | ||||||||||||||||
802.11b | up to 11 Mbps | ||||||||||||||||
WiFi Operating Frequency | 2.4 GHz | ||||||||||||||||
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For a list of all currently documented RFMD (Qorvo) chipsets with specifications, see RFMD.
For a list of all currently documented Samsung chipsets with specifications, see Samsung.
For a list of all currently documented Texas Instruments (TI) chipsets with specifications, see Texas Instruments.
For a list of all currently documented VIA chipsets with specifications, see VIA.
For a list of all currently documented D-Link devices with specifications, see D-Link.
- • 11 Mbps - 2.4GHz 802.11b = B11 class
Overview
OEM Global Sun GL2422AP-0T4
see Hacking the DWL-900AP+ (via archive.org) and the DWL-900AP+ page on Seattle Wireless
It appears the FCC ID some units (perhaps all or most A revision units, at least A2) is O7J-GL242204-0T.
CPU is part S3C4510B01-QERO.
- D-Link
- Embedded system/access point
- Embedded System Samsung
- Embedded System S3C4510B
- Samsung
- Embedded System ARM7TDMI-S
- Embedded System
- Embedded System VT6103
- Embedded System VIA
- VIA
- Embedded System Texas Instruments
- Embedded System ACX100
- Texas Instruments
- Embedded System RFMD
- RFMD
- Embedded System IEEE 802.11b
- Single-Radio Wireless Embedded System
- Wireless Embedded System
- Single-Band
- English Documentation