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Foxconn WIN-A2

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bgn (N150)
802.11n Wireless Module
default
Platform
BrandModelRev Foxconn WIN-A2
Interface SDIO
Connector SDIO
Form factor (module)

ID:02d0:a962

FCCID MCLWINA2
ICID 2878D-WINA2
Chip1 Broadcom BCM43362

OUI: none specified

Antenna Connection U.FL
MIMO status 1x1:1
Wireless Standards IEEE 802.11b/g/n
802.11n up to 150 Mbps
802.11g up to 54 Mbps
802.11b up to 11 Mbps
Operating Frequency 2.4 GHz
Other
Manuf/OEM/ODM Foxconn

Probable Linux driver
brcmfmac (SDIO in backports)
(see also passys)

Retail
FCC approval date 07 March 2011

For a list of all currently documented Broadcom chipsets with specifications, see Broadcom.

For a list of all currently documented Foxconn devices with specifications, see Foxconn.

150 Mbps - 1SS 2.4GHz 802.11n (40MHz chan.) = N150 class

Overview

  • This device is a wireless module in the Nintendo Wii U.
It is visible in iFixit's teardown of the unit.
  • The full part number of the Broadcom chip is BCM43362KUBG.
BCM43362 SDIO: 0xA962 brcmfmac (3.14+)